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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6529 Issued Date : 1992.12.16 Revised Date : 2002.10.09 Page No. : 1/4
HSC2240
NPN EPITAXIAL PLANAR TRANSISTOR
Description
Low noise audio amplifier applications
Absolute Maximum Ratings
TO-92
* Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ...................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ....................................................................................... 150 V VCEO Collector to Emitter Voltage .................................................................................... 150 V BVEBO Emitter to Base Voltage............................................................................................ 5 V IC Collector Current ....................................................................................................... 100 mA
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) VBE(on) *hFE fT Cob Min. 150 150 5 500 120 Typ. 100 3 Max. 100 100 300 800 400 Unit V V V nA nA mV mV MHz pF Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=120V, IE=0 VEB=5V, IC=0 IB=1mA, IC=10mA IC=2mA, VCE=6V VCE=6V, IC=2mA VCE=6V, IC=1mA, f=100MHz VCB=10V, f=1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Classification of hFE
Rank Range Y 120-240 GR 200-400
HSC2240
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 125 C
o
Spec. No. : HE6529 Issued Date : 1992.12.16 Revised Date : 2002.10.09 Page No. : 2/4
Saturation Voltage & Collector Current
1000
25 C 75 C
o
o
Saturation Voltage (mV)
75 C 100 125 C
o
o
hFE
100
hFE @ VCE=6V
25 C VCE(sat) @ IC=10IB
o
10 1 10 100 1000
10 0.1 1 10 100 1000
Collector Current-IC (mA)
Collector Current-IC (mA)
ON Voltage & Collector Current
1000
Cutoff Frequency & IC
1000
25 C
o
125 C
o
75 C
o
Cutoff Frequency (MHz).. .
ON Voltage (mV)
100
VCE=6V
VBE(ON) @ VCE=6V
100 0.1 1 10 100 1000
10 1 10 100 1000
Collector Current-IC (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
100 10000 PT=1ms PT=100ms
Safe Operating Area
Collector Current-IC (mA)
1000 PT=1s
Capacitance (pF)
10
100
Cob
10
1 0.1 1 10 100 1000
1 1 10 100 1000
Reverse Biased Voltage (V)
Forward Voltage-VCE (V)
HSC2240
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6529 Issued Date : 1992.12.16 Revised Date : 2002.10.09 Page No. : 3/4
PD-Ta
700 600
Power Dissipation-PD (mW)
500 400 300 200 100 0 0 50 100
o
150
200
Ambient Temperature-Ta ( C)
HSC2240
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A B
1 2 3
Date Code
Spec. No. : HE6529 Issued Date : 1992.12.16 Revised Date : 2002.10.09 Page No. : 4/4
2
Marking:
H SC 2240 Rank Control Code
3
C
Style: Pin 1.Emitter 2.Collector 3.Base
D
H I E F
G
1
3-Lead TO-92 Plastic Package HSMC Package Code: A
*: Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I 1 2 3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSC2240
HSMC Product Specification


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